| abstract |
It is an object of the present invention to remove water dispersible adhesive compositions which can be coated in an aqueous system, in particular, less contaminating the adhesive surface surface, having a high resistance to water penetration during the wafer polishing process, and particularly suitable as adhesive sheets for semiconductor wafer processing. It is to provide an adhesive composition capable of producing a water dispersible acrylic adhesive sheet. The present invention is an acrylic emulsion polymer obtainable by emulsion polymerization of a monomer mixture containing an alkyl (meth) acrylate ester and having a glass transition temperature of -80 to -20 ° C; And a crosslinker which is a carbodiimide crosslinker or a hydrazine crosslinker.n n n Wafer Processing, Acrylic Adhesives, Adhesive Sheets, Acrylic Emulsion Polymers, Carbodiimide Crosslinkers, Hydrazine Crosslinkers |