| abstract |
According to this plasma treatment method, the surface of the fine gap provided between the first treatment object and the second treatment object is treated. In this plasma processing method, the first processing object and the second processing object are disposed in the processing chamber. And the inside of the process chamber is depressurized and the mixed gas containing oxygen and helium is introduce | transduced. Further, in the pressure-reduced treatment chamber, plasma is generated to treat the surfaces of the first and second treatment objects that face each other in the microgap. By applying such a method to a work having a circuit board and an electronic component, which connects the electrode on the circuit board and the electrode of the electronic component, the sealing resin is easily filled between the circuit board and the electronic component. |