| abstract |
The present invention provides an SOD device 200 and provides a method of forming the same. In one aspect, a frame 220 is provided, which includes an interface surface 212. The interface surface is configured to reversely coincide with the device surface 210 of the diamond film 204. A non-dynamic diamond film 204 is deposited on the diamond interface film 212 of the mold 220, and the substrate 202 is bonded to the growth surface 232 of the non-dynamic diamond film 204. A portion 220 of the mold may be removed to expose the diamond device surface 210. The device surface receives the shape corresponding to the frame's diamond interface surface in reverse. The mold 220 is made of a suitable semiconductor material and is thinly run to produce the final device. Optionally, the semiconductor material may be connected to the diamond film 204 after removing the mold 220. |