| abstract |
A photosensitive resin composition is prepared by containing a polymer having (A) an acidic functional group and / or its derivative substituent, (B) a compound having at least one substituent derived from an amine functional group, (C) a photoreactive compound, and (D) a solvent. By constructing, it is possible to provide a heat-resistant photosensitive resin composition having good cured film physical properties, to use a photosensitive resin composition to produce a good resolution pattern, and to provide a high-quality electronic component. |