| abstract |
Provides substrate cleaning solution and cleaning method for semiconductor devices that can remove particle contamination, organic contamination and metal contamination at the same time without corroding the substrate surface, and also has good rinsing by water, and can highly clean the substrate surface in a short time. do.n n n Component (a): organic acid, component (b): organic alkali component, component (c): surfactant, and component (d): water, and the pH of the board | substrate cleaning liquid for semiconductor devices which is 1.5 or more and less than 6.5. A method of cleaning a substrate for semiconductor device, wherein the substrate cleaning liquid for semiconductor device has a Cu film and a low dielectric constant insulating film on the surface, and the substrate for semiconductor device is cleaned after CMP treatment. |