| Predicate |
Object |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-05647
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-05624
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-04042
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-0381
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-02076
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C11D1-14
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-78
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-94 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C11D3-33
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-67075
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C11D3-044
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C11D3-2075
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C11D3-2082
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B28D5-0076
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-30
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-78
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C11D11-0047
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C11D3-30 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-301
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-78 |
| filingDate |
2011-07-08-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
2013-08-20-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate |
2013-08-20-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
KR-101298193-B1 |
| titleOfInvention |
Wafer dicing method and compositions useful therein |
| abstract |
The present invention discloses a solution for semiconductor wafer dicing. The solution inhibits adhesion of contaminant residues or particulates during the process of dicing the wafer into the saw and reduces or eliminates corrosion of exposed metallization sites. The solution may comprise one or more organic acids and / or salts thereof; One or more surfactants and / or bases; And deionized water, wherein the pH of the composition is at least 4. The solution may further comprise a chelating agent, an antifoaming agent, or a dispersing agent. |
| priorityDate |
2010-07-09-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |