| abstract |
The present invention provides a highly sensitive positive photosensitive siloxane composition used for forming a planarization film, an interlayer insulating film, or an optical waveguide core or cladding material for TFT substrates having high heat resistance, high transparency, and low dielectric constant. A positive photosensitive siloxane composition containing a siloxane polymer, a quinonediazide compound, and a solvent, and having a light transmittance of 95% or more per 3 탆 thickness at a wavelength of 400 nm of the cured film of the composition.n n n Positive type, photosensitive, siloxane, cured film |