http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-20050118717-A

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filingDate 2004-03-29-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_a18a98ce967dd5faabd640b60a7d183e
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publicationDate 2005-12-19-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber KR-20050118717-A
titleOfInvention Method for forming structures in finfet devices
abstract The semiconductor device includes a first fin structure 810, a second fin structure 810, and a third fin structure 210. First and second fin structures 810 include a single crystal silicon material. The third fin structure 210 is located between the first fin structure 810 and the second fin structure 810 and includes a dielectric material. The third fin structure 210 causes stress induced in the single crystal silicon material of the first fin structure 810 and the second fin structure 810.
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Total number of triples: 29.