| abstract |
The high molecular compound for photoresists of this invention contains the monomeric unit which has a 2, 6- dioxabicyclo [3.3.0] octane frame | skeleton in a polymer structure, The said 2, 6- dioxabicyclo [3.3.0] octane The monomer unit represented by following General formula (I) is contained in the monomer unit which has a skeleton. The photoresist polymer compound may include a monomer unit having a 2,6-dioxabicyclo [3.3.0] octane skeleton, a monomer unit having a substrate adhesive group, and a monomer unit having an acid leaving group. The polymer compound for photoresists of the present invention is excellent in balance between not only substrate adhesion, acid detachability, dry etching resistance, but also solubility in resist solvent, and alkali solubility.n n n <Formula I>n n n n n n n n In the formula, R represents a hydrogen atom or a methyl group |