http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-20050038550-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_0d0c5e62bc89d4a361b8a96ff2310e78 |
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J2301-124 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J2203-326 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J7-35 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J7-22 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J7-02 |
| filingDate | 2004-10-13-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_0db9081980b7af2be60040dbe177266d http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_f39a39fc6f90ffa0e2927dac2f1afbb1 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_2e19f1ff10d34a0f4cb49c3eecf473d3 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_289fdcaf6a8facf35c412f80deb477d3 |
| publicationDate | 2005-04-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | KR-20050038550-A |
| titleOfInvention | Both sides coated tape for loc |
| abstract | The present invention is a polyimide base film having a glass transition temperature of 300 ℃ or more and a thickness of 5 ~ 150㎛;n n n An adhesive layer formed by coating a polyimide adhesive composition containing an acid end group on one surface of the polyimide base film; And an adhesive layer formed by coating a polyimide adhesive composition containing an amine end group on the other side of the polyimide substrate film, wherein the adhesive force with each of the adhesive layers is 0.8Kg on the polyimide substrate film. It relates to a double-sided tape for LOC having a peel strength of not less than / cm and a method of manufacturing the same.n n n The double-coated tape for LOC of the present invention simultaneously satisfies the adhesive properties between the lead frame made of metal and the semiconductor chip insulating film made of plastic, thereby lowering the conventional high temperature bonding process temperature to a relatively low process temperature, thereby reducing the reliability and reliability of the semiconductor package. It can contribute to increased yield. |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-100984728-B1 |
| priorityDate | 2003-10-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 87.