| Predicate |
Object |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B29K2995-0087
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B29C2045-14852
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B29K2715-006
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B29K2995-0026
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B29C2045-14713
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B29C2045-14737
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B29K2995-002
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B29L2009-00 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B29C37-0032
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B29C45-14688
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B29C45-14811
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-68
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B29C45-14
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B29B13-00 |
| classificationIPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B29K69-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B29K671-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B29K667-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B29K105-20 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B29D99-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B29C37-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B65D25-20
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B29C45-14
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B65D85-86
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B29B13-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-68
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-673 |
| filingDate |
2002-11-26-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate |
2004-06-29-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
KR-20040055815-A |
| titleOfInvention |
Informational polymer film insert molding |
| abstract |
Systems and methods are provided that use thin polymeric film members 34 to bond indicia 36 in the molding process of wafer containers 10 and other plastic products used in the semiconductor manufacturing industry, particularly in clean room environments. The system and method provide a protective fouling barrier that enables multicolor marking and unique electronically readable markings to be bonded to the article and also suppresses process contamination resulting from the marking and protects the marking from physical damage. |
| priorityDate |
2001-11-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |