Predicate |
Object |
assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_f50f95c17e4934fb9f9810574cdf87aa |
classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-02274 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-31 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C16-30 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76832 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76835 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-7684 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-022 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-02216 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-31633 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-02126 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-3212 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C16-56 |
classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23C16-30 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-321 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-316 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-31 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-768 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23C16-56 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-522 |
filingDate |
2003-09-09-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_71b27cb90f7c7ad88b2063dca571646d http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_1715b360be57193df1e2d47cf9cd927a http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_b4a44f4441b172daebd10fba45847980 |
publicationDate |
2004-03-18-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber |
KR-20040023557-A |
titleOfInvention |
Interlayer Insulation Film Used For Multilayer interconnect of Semiconductor Intergrated Circuit And Method Of Manufacturing The Same |
abstract |
An interlayer insulating film used for the multilayer interconnection of a semiconductor integrated circuit according to the present invention comprises: forming a first insulating film on a substrate by plasma CVD using a silicon-containing hydrocarbon gas; It is formed by continuously forming the second insulating film on the first insulating film at a thickness less than the first insulating film in situ by plasma CVD using a silicon-containing hydrocarbon gas and an oxidizing gas. The second insulating film has a strength of 6 GPa or more and is used as the polishing stop layer. |
isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-20220133835-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-100648632-B1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-20150037638-A |
priorityDate |
2002-09-09-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type |
http://data.epo.org/linked-data/def/patent/Publication |