abstract |
Corrosion resistant components of semiconductor processing equipment, such as plasma chambers, comprise a cerium oxide containing ceramic material as the outermost surface of the component. The cerium oxide containing ceramic material includes one or more cerium oxides as its single largest component. The component may be wholly cerium oxide-containing ceramic material, and the cerium oxide-containing ceramic may be provided as a layer on a substrate such as aluminum or aluminum alloy, ceramic material, stainless steel or refractory metal. The cerium oxide containing ceramic layer can be provided as a coating by techniques such as plasma spraying. One or more intermediate layers may be provided between the part and the cerium oxide containing ceramic coating. In order to improve the adhesion of the cerium oxide ceramic coating, the part surface or the interlayer surface may be surface roughened prior to depositing the cerium oxide containing ceramic coating. |