Predicate |
Object |
assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_5547f741b25666fc4ae5195cf71a979b |
classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-312 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-02164 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-3122 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-3127 |
classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-022 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-3065 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-31138 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76802 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76832 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-02126 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-02118 |
classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-522 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-768 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-302 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-31 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-3065 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-312 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-311 |
filingDate |
2002-02-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_7fb4dba70f22aad6717378600b3708c0 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_3e9014cc8c04e2e73f9f4f0c9f21532e http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_4901c9c0e18eb8f9f0c4805be4e7da48 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_02bc17991889985479ab8cf2a397b46a |
publicationDate |
2002-08-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber |
KR-20020068958-A |
titleOfInvention |
Method of Manufacturing a Semiconductor Device and the Semiconductor Device |
abstract |
The present invention is to provide a technique for etching a plurality of organic films with a high selectivity ratio.n n n The method for manufacturing a semiconductor device of the present invention is a method for manufacturing a semiconductor device comprising the step of forming a silicon non-containing organic film (35) by using a mixed gas plasma of nitrogen and hydrogen for a composite film composed of a silicon- 35) is etched. |
isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-100788074-B1 |
priorityDate |
2001-02-22-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type |
http://data.epo.org/linked-data/def/patent/Publication |