abstract |
Water soluble tin salts; Water-soluble copper salts; Inorganic or organic acids or water soluble salts thereof; And a tin-copper alloy electroplating bath consisting of one or more compounds selected from thioamide compounds and thiol compounds. The present invention provides tin-copper alloy deposits, instead of tin-lead alloy plating, on electronic components such as chips, crystal oscillators, hoops, connector pins, lead frames, bumps, lead pins of packages and printed circuit boards. Makes it possible. |