http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-100725026-B1
Outgoing Links
| Predicate | Object |
|---|---|
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-48 |
| filingDate | 2005-11-14-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2007-06-07-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate | 2007-06-07-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | KR-100725026-B1 |
| titleOfInvention | Lead Frames for Semiconductor Devices |
| abstract | BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a substrate for manufacturing an environmentally friendly semiconductor device, wherein the substrate for manufacturing a semiconductor device is an intermediary means for electrically connecting an electrical and electronic device such as a semiconductor chip and a printed circuit board. The material of the substrate for manufacturing a semiconductor device is copper, or a copper alloy and nickel or a nickel alloy, and various plating layers are formed on the surface of the substrate for manufacturing a semiconductor device to prevent oxidation of the surface and improve weldability with electrical and electronic devices. It was. In the past, a tin / lead alloy was plated on the surface of a copper substrate as a method for realizing this purpose. However, as lead is regulated as an environmentally unfriendly material, various methods have been proposed to replace it. Therefore, the present invention is to improve the above problems by interposing a tin alloy coating film on the surface of copper (Cu) or copper alloy material and plated Ni or Ni alloy (alloy) on the upper surface thickness of 0.0254 ~ 0.1016 ㎛ palladium or A palladium alloy film is formed, and an alloy layer made of gold having a thickness of 0.0127 to 0.1016 µm or less is formed on the lead frame in the outermost layer to improve bonding, solderability, molding bonding force, corrosion, and cracks. It was possible to provide a substrate for device manufacture. |
| priorityDate | 2005-11-14-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 25.