http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-19990072607-A
Outgoing Links
| Predicate | Object |
|---|---|
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-0002 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-5226 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76802 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-768 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-3065 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-3205 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-28 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-768 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-302 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-52 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-522 |
| filingDate | 1999-02-11-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate | 1999-09-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | KR-19990072607-A |
| titleOfInvention | Method of manufacturing semiconductor device |
| abstract | In the method of manufacturing a semiconductor device, in a first step, a lower layer wiring is formed on a semiconductor substrate via a first interlayer insulating film. In a second step, a second interlayer insulating film is formed on the semiconductor substrate including the lower wiring. In the third step, through holes are formed in the second interlayer insulating film so as to reach the lower layer wirings. In the fourth step, after completion of the third step, the surface of the lower wiring including the side surface exposed to the bottom of the through hole is etched without exposing the semiconductor substrate to the atmosphere. In a fifth step, a plug made of a conductive material is formed in the through hole. In the sixth step, upper wiring to be connected to the plug is formed on the second interlayer insulating film. |
| priorityDate | 1998-02-12-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
| Predicate | Subject |
|---|---|
| isDiscussedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID419559562 http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID14917 |
Total number of triples: 20.