| abstract |
A method for producing a bonded body of an aluminum nitride-based substrate in which a third layer is not substantially interposed at the bonded interface of the substrates is provided. In the method, a bonding aid (3) is inserted between the substrates (1, 2), and the substrate and the bonding aid are heated at a temperature above the melting point of the bonding aid to melt the bonding aid and aluminum nitride. Liquefied particles of liquid to form a liquid phase near the interface between the molten bonding aid and the substrates, and then heating the substrates and the bonding aid at a temperature higher than the temperature and lower than the sintering temperature of the substrates. By discharging the bonding aid from between the substrates, the aluminum nitride based substrates 1 and 2 are bonded to each other. |