http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-19980032136-A
Outgoing Links
| Predicate | Object |
|---|---|
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B24B37-042 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-30625 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09G1-02 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-31053 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-304 |
| filingDate | 1997-05-30-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate | 1998-07-25-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | KR-19980032136-A |
| titleOfInvention | Semiconductor substrate polishing method for polishing the surface of semiconductor substrate to form a flat surface shape |
| abstract | A method of polishing a semiconductor substrate for planarizing the surface of the semiconductor substrate includes a main polishing step and a finish polishing step. The main polishing step is used to polish the surface of the semiconductor substrate using the first polishing liquid. The finish polishing step is used to polish the surface of the semiconductor substrate using a chelating agent. Thus, metallic contaminants are efficiently removed from the semiconductor substrate after being polished by a small number of process steps. |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-101232813-B1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-100693640-B1 |
| priorityDate | 1996-05-31-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 30.