| abstract |
An integrated circuit device is disclosed. An integrated circuit device includes a substrate, a landing pad disposed on the substrate, and a through via structure penetrating the substrate and connected to the landing pad, wherein the through via structure comprises: a conductive plug; A first conductive barrier layer enclosing a sidewall and a bottom surface of the conductive plug, and a second conductive barrier layer enclosing a sidewall of the first conductive barrier layer. |