| abstract |
An object of the present invention is to provide a resin composition capable of forming an adhesive layer excellent in adhesion to both of a conductor layer and an organic insulating substrate, high heat resistance, and excellent in solder resistance after moisture absorption. The present invention is a resin composition containing an epoxy resin (A) having two or more epoxy groups in one molecule, a polyarylate resin (B) and a curing agent (C), the glass transition temperature of the polyarylate resin (B) is 200°C or higher, and the content ratio (A)/(B) of the epoxy resin (A) to the polyarylate resin (B) is 30/70 to 90/10 (mass ratio). |