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classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-40
filingDate 2003-01-22-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_e90e4125624314788a3d95eaa199cef8
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_81eacbeeb03d058be4bdb08477f29f2c
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publicationDate 2004-08-12-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-2004224890-A
titleOfInvention Method for producing cured product of epoxy resin composition
abstract An object of the present invention is to provide a method for producing a cured product of an epoxy resin composition which retains low dielectric properties, heat resistance, low water absorption and mechanical properties of polyarylate, and hardly causes phase separation and embrittlement. A method for producing a cured product of an epoxy resin composition containing an epoxy resin, a polyarylate, an active ester compound and a curing accelerator, comprising: (1) an epoxy resin, a polyarylate, an active ester compound and a curing accelerator. Is dissolved in an organic solvent, and the organic solvent is removed at 20 to 150 ° C. to obtain an epoxy resin molded product. (2) The epoxy resin molded product reacts with the epoxy resin and the polyarylate. A method of producing a cured product of an epoxy resin composition, comprising: a step of pre-curing at a temperature that does not occur; and (3) a step of curing the pre-cured epoxy resin molded product at a temperature lower than the glass transition temperature of the polyarylate. [Selection diagram] None
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