http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-102334672-B1
Outgoing Links
| Predicate | Object |
|---|---|
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J9-02 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01B1-22 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-34 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-34 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01B1-22 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J9-02 |
| filingDate | 2015-06-02-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2021-12-06-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate | 2021-12-06-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | KR-102334672-B1 |
| titleOfInvention | Curable composition and electronic component |
| abstract | (Project) To provide the curable composition which does not have the conventional problem, can ensure the adhesive strength excellent at low temperature, low pressure, and a short time, and can electrically connect members. (Solution) The curable composition of the present invention is characterized in that it contains (A) a compound having an ethylenically unsaturated bond, (B) a peroxide, and (C) a solder powder. In addition, the curable composition of the present invention is a composition containing (A) an organic component including a compound having an ethylenically unsaturated bond, (B) a peroxide, (D) an organic binder, and (C) a conductive powder, It is characterized in that the ethylenically unsaturated bond equivalent in the component (when a solvent is included, the solvent is excluded) is 260 or more. |
| priorityDate | 2014-06-03-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 160.