| abstract |
In the present invention, when anisotropic conductive connection of an electrical element to a wiring board is performed using solder particles, the wiring board and the electrical element are connected to each other by anisotropic conductive connection in order to lower the main heating temperature of the thermosetting adhesive to realize good connection reliability. When manufacturing, the thing which the solder particle of melting temperature Ts disperse | distributed in insulating acrylic thermosetting resin of minimum melt viscosity temperature Tv is used as an anisotropic conductive adhesive agent. In the first heating pressurization step, the anisotropic conductive adhesive is melted and flowed out and pressed out from the gap between the wiring board and the electrical element to be precured. In the second heat pressurization step, the solder particles are melted to form a metal bond between the electrode of the wiring board and the electrode of the electric element to thereby harden the anisotropic conductive adhesive. When heating temperature of a 1st heating press process is T1, pressurization pressure is P1, heating temperature of a 2nd heating pressurization process is T2, and pressurization pressure is set to P2, Tv <T1 <Ts <T2 and P1> P2 is satisfied. |