| Predicate |
Object |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-16235
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-1461
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-10145
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-94 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-11
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-94
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-12
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-56
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-49816 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-498
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-56 |
| filingDate |
2019-05-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
2021-11-22-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate |
2021-11-22-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
KR-102328922-B1 |
| titleOfInvention |
Wafer level packaging method with solderball for Cap wafer, and Cap wafer |
| abstract |
A wafer level packaging method using a solder ball and a cap wafer are provided. The wafer level packaging method of the present invention includes the steps of: providing a cap wafer having a cavity formed on one surface and a wetting layer formed along an outer periphery of the cavity; forming solder balls at predetermined intervals along the wetting layer; and attaching the cap wafer on which the solder balls are formed on the MEMS device wafer and then bonding the MEMS device wafer and the cap wafer by pressing. |
| priorityDate |
2019-05-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |