| abstract |
PROBLEM TO BE SOLVED: To provide a hermetic sealing method capable of preventing oxidation in a movable microminiature mechanical structure element and sealing at a low temperature. A step of depositing a bonding layer, a wetting layer and a solder layer on a prepared lid, and a step of depositing a first protective layer for preventing oxidation on the solder layer. Forming a package base 1 on which the element 4 is disposed and a metal layer 9 and a second protective layer 10 are formed around the element 4, and assembling the lid 2 and the package base 1. And sealing by heating. Accordingly, the first protective layer 8 can be laminated on the solder layer 7 formed on the lid 2 to prevent oxidation without flux and to perform sealing at a low temperature. Suitable for devices that are sensitive to heat, moisture, and other by-products, such as MS devices. |