| abstract |
The resin composition for sealing of this invention contains an epoxy resin (A), a hardening|curing agent (B), an inorganic filler (C), and the compound (D) represented by following formula (1). In Formula (1), R< 1> is a polar group or a hydrocarbon group. The electronic component device 10 of this invention is the electronic component device 10 which has the electronic component 11 and the sealing material 12 which seals the electronic component 11. WHEREIN: The sealing material 12 is the said sealing material. It is a hardened|cured material of the resin composition for use. |