| abstract |
An epoxy resin molding material for sealing capable of forming a sealing body excellent in reflow resistance, and an electronic component device including an element sealed thereby. A sealing epoxy resin molding material containing an epoxy resin having two or more epoxy groups in one molecule, a curing agent, and a carboxylic acid amide derivative having one or more phenolic hydroxyl groups in one molecule. . Moreover, it is an electronic component apparatus provided with the element sealed with this epoxy resin molding material for sealing. [Selection figure] None |