| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_7da919fed89fc445b2320f29c217e6ef |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B29C2037-0046
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K2201-017
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B29L2007-008
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B29K2101-10
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B29C2037-0035
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B29C2035-0827
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B29C2059-023 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08F283-10
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08F283-06
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08F220-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08F222-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B29C37-0025
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08F2-48
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B29C35-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08F2-44
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B29C59-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08F265-06
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B27-18 |
| classificationIPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B29K101-10
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B29L7-00 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08F2-44
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B32B27-18
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B29C59-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B29C59-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B29C37-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B29C35-08
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B29C35-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08F283-10 |
| filingDate |
2020-08-18-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
2021-09-02-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_d36f357ab63c70d6cb72f1e764a219f1 |
| publicationDate |
2021-09-02-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
KR-102297307-B1 |
| titleOfInvention |
Preparation method of embossing release film for semiconductor package mold, and embossing release film thereof |
| abstract |
The present invention relates to a method for manufacturing an embossed release film for a semiconductor package mold and an embossed release film therefor. There is no restriction on the thickness or release force of the release film, and core properties such as tensile strength and elongation can be freely adjusted. In particular, the embossed substrate layer is used to form a more diverse and uniform surface than when a roughness former is used. It is characterized in that it provides illumination. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-102407517-B1 |
| priorityDate |
2020-08-18-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |