| abstract |
(Task) Wafers can be collectively molded, and in particular, have good moldability for large-diameter, thin-film wafers, and at the same time provide low warpage and good wafer protection performance, good adhesion, good reliability and good heat resistance after molding, and mold Providing a resin composition and a resin film that can satisfactorily perform a process and can be used suitably for a wafer level package, a method for producing the resin film, and a semiconductor device molded by the resin film, and the semiconductor device Provides a manufacturing method. (Solution means) A resin characterized in that it contains a silicone resin (A), (B) an epoxy resin curing agent, and (C) a filler having a weight average molecular weight of 3,000 to 500,000 having a structural unit represented by the following composition formula (1). Composition. |