| abstract |
PROBLEM TO BE SOLVED: To provide a novel compound, a bisnadiimide-polysiloxane alternating copolymer, a derivative thereof, and a method for producing the same, and to further provide mechanical strength, adhesion, and adhesion containing the novel compound. Provided is an epoxy resin composition for electronic materials, particularly for semiconductor encapsulation, which has reduced stress and improved resistance to heat history without impairing heat resistance. A bisnadiimide-polysiloxane alternating copolymer and a bisnadiimide-polysiloxane alternating copolymer are produced by a hydrosilylation reaction of an unsaturated group-containing group-substituted bisnadiimide (A) and a polysiloxane (B) having SiH groups at both ends of the molecule. Provided as derivatives, and further provided with epoxy resin compositions for electronic materials, especially for semiconductor encapsulation by blending the alternating copolymer. |