http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-102146290-B1
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_bd53f2015d5b061d9f8021311fe91966 http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_90dea8e861698c5ceb00b526db776f95 http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_212a8394d6799c172a3d38ea00fd7f3e |
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01R2201-20 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G01R1-0458 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G01R1-0466 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G01R1-07314 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01R13-62905 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G01R1-06716 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G01R31-2886 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G01R1-06711 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K7-10 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G01R1-0483 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G01R1-07307 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G01R1-04 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G01R31-28 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G01R1-067 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G01R1-073 |
| filingDate | 2019-04-04-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2020-08-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_2238f071b3e6196bae73644c1a4c9c4d http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_9a129239c79086bf7ef30d998e4a978a http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_8e3a952db4dbe8eec6cb307badfc59c3 |
| publicationDate | 2020-08-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | KR-102146290-B1 |
| titleOfInvention | Lidless BGA Socket device for testing an BGA IC |
| abstract | In general, the present invention is a lidless type in which a cover provided on an upper portion of a socket body is removed for an IC loading/unloading operation, and an element that may obstruct air flow during a test can be excluded. It relates to a BGA socket device. The lidless BGA socket device for testing a semiconductor device of the present invention includes a contact 100; Slider receiving portion including a slider receiving portion (210b) recessed with respect to the horizontal upper surface, and a cam support portion (212a) recessed from the upper surface (210a) around the slider receiving portion (210b) to form one end sidewall A main body portion 210 to which the contact 100 is fixed to the lower surface of 210b; It is provided so as to be able to slide back and forth in the horizontal direction within the slider receiving part 210b, and a cam contact part 231 is provided at one end facing the cam support part 212a by the lateral operation force applied to the cam contact part 231. A slider 230 which makes the front and rear sliding and transmits a lateral operation force to the contact 100 according to the front and rear sliding position to bring the terminal 2 of the IC 1 into contact with the contact 100; Generates a contact contact force provided between the main body 210 and the slider 230 to elastically support the slider 230 in the movable direction to provide a contact force between the contact 100 and the terminal 2 of the IC 1 Includes a spring 241. |
| priorityDate | 2019-04-04-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 33.