http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-H11312566-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_6572309f22e2ad56c1390a78ac237bed |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-32 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G01R31-26 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01R33-76 |
| filingDate | 1998-04-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_2f22a933a77e69e369f57ffe0efba8a2 |
| publicationDate | 1999-11-09-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-H11312566-A |
| titleOfInvention | Socket for connecting semiconductor package |
| abstract | (57) [Summary] [PROBLEMS] To reduce the number of parts, simplify and simplify the assembling work, eliminate the possibility of malfunction or breakage of a semiconductor package due to heat, simplify the design of a board, and achieve high-frequency characteristics. Provided is a socket for connection of a semiconductor package which can be expected to be improved. SOLUTION: A contact member 8 connects an electrode terminal 2 of a circuit board 1 and an electrode terminal 7 of a semiconductor package 5, Socket member 1 for positioning and housing semiconductor package 5 9, a compression member 25 for pressing the contact member 8 and the electrode terminal 7 of the semiconductor package 5 into contact with each other. The contact member 8 is formed by positioning the positioning plate 9 mounted on the circuit board 1 and a part of the positioning plate 9. And the anisotropic conductive sheet 10 to be formed. Further, the anisotropic conductive sheet 10 is formed by embedding a plurality of conductive wires 15 for connecting the electrode terminals 2 and 7 to the elastic sheet 14 having an insulating property in a penetratingly bent state. The compression member 25 is composed of a compression protrusion 26 that comes into contact with the semiconductor package 5 and a radiator 27 that radiates heat generated from the semiconductor package 5. |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-102146290-B1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2022528093-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2002221419-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-I735165-B http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-100517022-B1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-4701505-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-6979203-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2020204245-A1 |
| priorityDate | 1998-04-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
| Predicate | Subject |
|---|---|
| isDiscussedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID425966752 http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID3085227 |
Total number of triples: 22.