http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-102098758-B1
Outgoing Links
| Predicate | Object |
|---|---|
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J11-06 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-50 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J163-10 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J11-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J163-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-60 |
| filingDate | 2013-08-05-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2020-04-09-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate | 2020-04-09-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | KR-102098758-B1 |
| titleOfInvention | Circuit connection material |
| abstract | The present invention provides a circuit connecting material capable of suppressing the occurrence of warpage. The circuit connecting material according to the present invention contains a β-methyl type epoxy resin and a cationic polymerization initiator. As a β-methyl type epoxy resin, bisphenol A type β-methyl epoxy resin, bisphenol F type β-methyl epoxy resin, and dicyclopentadiene type β-methyl epoxy resin are used alone or in combination to improve low temperature curing properties. , The generation of warpage can be suppressed. In particular, the dicyclopentadiene-type β-methyl epoxy resin can reduce the stress by its bulky skeleton and make the amount of warpage smaller. |
| priorityDate | 2012-08-06-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 38.