| abstract |
The present invention relates to a method of manufacturing a substrate assembly (10; 10 '; 10 ") for attachment to an electronic component (30; 30'), Providing a substrate 11 having a first side 12 and a second side 13, Applying a layer of contact material 15 to the first side 12 of the substrate 11, Applying the preliminary fixative 18 to a portion of the side 16 of the contact material layer 15 facing at least away from the substrate 11. |