http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-102056178-B1
Outgoing Links
| Predicate | Object |
|---|---|
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J2201-622 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J163-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J201-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J11-04 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J11-08 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J7-20 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J7-28 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J133-00 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J7-28 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J11-04 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J7-20 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J133-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J11-08 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J163-00 |
| filingDate | 2016-11-14-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2019-12-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate | 2019-12-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | KR-102056178-B1 |
| titleOfInvention | Tape for Electronic Device Package |
| abstract | An electronic device package capable of suppressing warpage in the laminate of the semiconductor, the adhesive layer and the semiconductor chip when pre-curing the adhesive layer, and suppressing the generation of voids in the adhesive layer during flip chip connection. Provide tape for The tape for an electronic device package of this invention is provided in the adhesive tape which has a base film and an adhesive layer, the metal layer formed by laminating | stacking on the opposite side to the base film of an adhesive layer, and the opposite side to the adhesive layer of a metal layer, and a metal layer is an electronic device It has an adhesive bond layer for adhere | attaching on the back surface of the adhesive agent, The adhesive bond layer has the storage elastic modulus in 25 degreeC after heating at 100 degreeC for 3 hours is 10 GPa or less, and the hardening rate at the time of heating at 100 degreeC for 3 hours is 10 to 100%. It is characterized by that. |
| priorityDate | 2016-03-31-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 102.