| abstract |
Disclosed is a flip chip type semiconductor back film capable of preventing the occurrence of spots even when flux is attached and capable of producing a semiconductor device having excellent appearance. A flip chip type semiconductor back film disposed on a back surface of a semiconductor element to be flip chip connected to an adherend, an adhesive layer, and a protective layer laminated on the adhesive layer The protective layer is a flip chip type semiconductor back film made of a heat resistant resin or metal having a glass transition temperature of 200 ° C. or higher. [Selection] Figure 1 |