| abstract |
[PROBLEMS] Coated silicon containing excellent adhesion in a fine pattern, and easily wet-etched with a peeling liquid that does not damage a coated organic film or a CVD film containing carbon as a main component required for a semiconductor substrate or a patterning process. The composition for film formation is provided. [Solution] It has at least one kind of structure having a silicic acid represented by the following general formula (1) as a skeleton, and at least one kind of structure having a silicon represented by the following general formula (2) as a skeleton, A composition for forming a coated silicon-containing film, comprising connecting units represented by the general formula (2). [Formula 1] [Formula 2] |