http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-101982200-B1
Outgoing Links
| Predicate | Object |
|---|---|
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J2201-622 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J2203-326 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J2201-162 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-67132 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J7-29 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J7-20 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-67 |
| filingDate | 2017-09-15-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2019-05-24-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate | 2019-05-24-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | KR-101982200-B1 |
| titleOfInvention | Back grinding tape for protecting semiconductor wafer |
| abstract | An embodiment relates to a back grinding tape for protecting a semiconductor wafer, wherein an embodiment contains an aromatic compound having a specific structure and can control a content of the aromatic compound to an appropriate level, thereby having a wider range of elastic modulus when grinding a semiconductor wafer, The modulus of elasticity can be maintained at an appropriate level, so that the shock absorption at the time of grinding is easy, so that the damage of the chip can be minimized. In addition, since the chemical structure and the heat resistance can be improved by including the aromatic structure compound, it can be usefully used in the production of semiconductor devices. |
| priorityDate | 2017-09-15-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 50.