| abstract |
In the present invention, 200 g of the epoxy resin composition is sieved in the order of 150 mu m, 250 mu m, 355 mu m, 500 mu m, 600 mu m, 850 mu m, 1000 mu m, 1700 mu m, To an epoxy resin composition for encapsulating a granular semiconductor element having an average particle size of 500 to 1,200 μm measured by the following formula 1 after being charged into a laminated body vibrator and then classified at 80 rpm for 10 minutes. <Formula 1> Di is the size (占 퐉) of the lattice of the i-th laminated body, Di + 1 is the refractive index of the i + The size of the lattice of the first stacked body (㎛). |