http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2008303366-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_b19eaa8e535da4e4bceed99917a68153 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-56 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-31 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-29 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-18 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08J3-12 |
| filingDate | 2007-06-11-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_71132196901f53a06ae394b7af0f8875 |
| publicationDate | 2008-12-18-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-2008303366-A |
| titleOfInvention | Epoxy resin composition for semiconductor encapsulation, method for producing the same, and semiconductor device using the same |
| abstract | The present invention provides an epoxy resin composition for semiconductor encapsulation and a method for manufacturing the same, which can improve the yield during compression molding and the quality of the semiconductor device when a semiconductor device is obtained by encapsulating semiconductor elements by compression molding. thing. An epoxy resin composition for semiconductor encapsulation used in a semiconductor device in which a semiconductor element is encapsulated by compression molding, comprising a cylindrical outer peripheral portion 2 having a plurality of small holes and a disk-shaped bottom surface. The melted and kneaded epoxy resin composition is supplied to the inner side of the rotor 1, and the epoxy resin composition is obtained by passing the small holes by centrifugal force obtained by rotating the rotor 1. A granular epoxy resin composition for encapsulating a semiconductor, a method for producing the same, and a semiconductor device obtained by encapsulating a semiconductor element using the same. [Selection] Figure 1 |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2010159400-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-20210021049-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-101900549-B1 |
| priorityDate | 2007-06-11-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 52.