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filingDate 2010-12-20-04:00^^<http://www.w3.org/2001/XMLSchema#date>
grantDate 2018-04-19-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationDate 2018-04-19-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber KR-101837648-B1
titleOfInvention InĀ­situ ozone cure for radicalĀ­component cvd
abstract Methods of forming a dielectric layer are described. Such methods include mixing a silicon-containing precursor with a plasma effluent, and depositing a silicon-and-nitrogen-containing layer on the substrate. The silicon-and-nitrogen-containing layers are converted into silicon-and-oxygen-containing layers by curing in an ozone-containing atmosphere in the same substrate processing region used to deposit the silicon- and-nitrogen-containing layers. Other silicon-and-nitrogen-containing layers may be deposited on the silicon-and-oxygen-containing layer and the stack of layers may all be cured again in the ozone without removing the substrate from the substrate processing region. After the deposition-cure cycle of an integer multiple, the transformer of the stack of silicon-and-oxygen-containing layers may be annealed at a higher temperature in an oxygen-containing environment.
priorityDate 2010-01-07-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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