http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-101764166-B1

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http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-3065
classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-3065
filingDate 2010-08-10-04:00^^<http://www.w3.org/2001/XMLSchema#date>
grantDate 2017-08-02-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationDate 2017-08-02-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber KR-101764166-B1
titleOfInvention Silicon-selective dry etch for carbon-containing films
abstract Methods of etching silicon and carbon containing materials are described, which include SiConi etching with the flow of active oxygen. Prior to SiConi ™ etching, active oxygen can be introduced, which reduces the carbon content within adjacent surface areas and makes the SiConi ™ etching proceed faster. Alternatively, during SiConi ™ etching, active oxygen may be introduced which further improves the effective etch rate.
priorityDate 2009-08-31-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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