| abstract |
The present invention relates to a plating solution for electroless silver plating and an electroless plating method using the same, which comprises a step of preparing and cleaning a metal material, a step of cleaning a metal material such as silver nitrate (AgNO 3 ), a copper salt, a nickel salt, , A discoloration inhibitor and a surfactant, comprises immersing, washing and drying the cleaned metal material in a plating solution. Thus, the present invention provides a method for cleaning a metal material to be plated, (Ni) or copper (Cu), and a reducing agent is deposited, washed and dried in a plating solution to form an initial silver plating layer through an initial substitution reaction during formation of a silver plating layer, The plating layer can be relatively thickly plated. |