| Predicate |
Object |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23C18-44
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23C18-40
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23C18-36
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23C18-34
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-3205
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-52
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-28 |
| filingDate |
1995-06-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
2002-10-07-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate |
2002-10-07-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
JP-3332668-B2 |
| titleOfInvention |
Electroless plating bath used for forming wiring of semiconductor device and method for forming wiring of semiconductor device |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-101736300-B1 |
| priorityDate |
1994-07-14-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |