| Predicate |
Object |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C01P2004-03
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C01P2002-85
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y02E10-549
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H10K85-1135
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C01P2006-40 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C01G13-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C01G5-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C01G15-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H10K77-10
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C01G45-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C01G19-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C01G21-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H10K30-81
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H10K30-87
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C01G3-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L31-02366
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C01G11-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C01G9-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C01G31-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C01G53-04 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-3065 |
| filingDate |
2011-01-05-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
2017-04-25-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate |
2017-04-25-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
KR-101729951-B1 |
| titleOfInvention |
Irregular-surface forming method using plasma-etching process, and electrode member |
| abstract |
A surface irregularity forming method using a plasma etching treatment in which a substrate having predetermined surface irregularities is obtained stably and precisely, and an electrode member obtained by such a forming method. A method of forming a surface irregularity pattern on a substrate by using a partially oxidized metal salt film as a resist while having a fine surface irregularity and performing a plasma etching treatment, A first step of applying a liquid material to form a metal salt film; a second step of forming a metal salt film with fine surface irregularities and partial oxidation to form a resist; and a step of subjecting the substrate to plasma etching And a third step of forming predetermined surface irregularities on the substrate. |
| priorityDate |
2010-03-23-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |