http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-101684588-B1
Outgoing Links
| Predicate | Object |
|---|---|
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-02126 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-3105 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-02337 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C16-401 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-67207 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C16-56 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-67178 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-68 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-6719 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-324 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-3105 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/F26B25-004 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-67201 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-67196 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-3105 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-68 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-324 |
| filingDate | 2011-10-05-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2016-12-08-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate | 2016-12-08-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | KR-101684588-B1 |
| titleOfInvention | System for processing a substrate |
| abstract | The substrate processing system has a plurality of deposition chambers and a first robot arm operable to move the substrate between one of the deposition chambers and the load-lock substrate holding region. The system may also have a second robotic arm operable to move the substrate between the load-lock substrate holding region and the hardening chamber of the substrate hardening and processing module. The substrate curing and processing module may include a curing chamber attached to the load-lock substrate holding region for curing the dielectric layer in an atmosphere containing ozone and a processing chamber for treating the cured dielectric layer in an atmosphere comprising water vapor have. The curing chamber may be positioned perpendicular to the processing chamber. The module may also include a heating system operably coupled to the curing chamber and the processing chamber such that the heating system adjusts the first temperature of the curing chamber to about 150 ° C to about 200 ° C, RTI ID = 0.0 > 80 C < / RTI > to about 100 C. The module may further include an access door in both the curing chamber and the process chamber. Each access door is operable to move to an open position to receive a substrate and to move to a closed sealed position when the substrate is being cured or being processed. |
| priorityDate | 2010-10-05-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 30.