| abstract |
The present invention relates to a wafer (1); A carrier layer system (5, 6); And a separation layer (4) provided between the carrier layer system (5,6) and the wafer (1), the carrier layer system (5,6) comprising (i) a carrier layer (6) (Iii) a plasma polymer layer, and (iv) an elastic layer (4) selected from a fully cured elastomer, a partially cured elastomer or a curable elastomer on one side of the separating layer, Carrier arrangement in which the adhesive force between the carrier layer system 5, 6 and the separating layer is greater than the adhesion force between the wafer and the separating layer after the substrate is fully cured. |