| abstract |
The present invention provides a method of manufacturing a semiconductor device comprising a substrate on which a selectively binding substance is immobilized on a surface thereof and a cover member adhered to the substrate and having a gap between the substrate and the cover member, Which is an analytical chip in which the surface of the fine particles is coated with a surfactant. According to the present invention, it is possible to suppress the occurrence of bubbles which inhibit the selective reaction between the substance to be tested and the immobilized selective binding substance, thereby suppressing fluctuation of data and lowering in sensitivity and increasing the reproducibility of measurement.n n n n Substrate, cover member, void, analyzing chip, fine particle |