http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-101362572-B1

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filingDate 2006-01-12-04:00^^<http://www.w3.org/2001/XMLSchema#date>
grantDate 2014-02-13-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationDate 2014-02-13-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber KR-101362572-B1
titleOfInvention Thermally stabilized molding composition
abstract The present invention relates to (a) a semicrystalline polyamide having a melting point (Tm-1) or an amorphous poly having a glass transition temperature (Tg-1) of 50% by mass or more relative to the total mass of the (a.1) thermoplastic polyamide composition. Semi-crystalline polyamide with amide first polyamide (PA-1) and (a.2) melting point (Tm-2) or amorphous polyamide with glass transition temperature (Tg-2) and C / N of 7 or less A thermoplastic polyamide composition consisting of a blend of two or more polyamides comprising a second polyamide (PA-2) having a ratio (wherein Tm-1 and Tg-1 are represented by T-1 and T-1 is 200 At least C, wherein Tm-2 and Tg-2 are together represented by T-2, and T-2 is at least 20C lower than T-1); (b) from a group consisting of phenolic heat stabilizers, organic phosphites, aromatic amines, metal salts of IB, IIB, III and IV elements of the periodic table of the elements and metal halides of alkali and alkaline earth metals, and combinations thereof Stabilization system comprising a heat stabilizer selected; And (c) metal oxides of salts of VB, VIB, VIIB, and VIIIB transition metals of the Periodic Table of the Elements or salts thereof or mixtures thereof.n n n Heat stabilized molding compositions, thermoplastic polyamides.
priorityDate 2005-01-17-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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